Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/14/2011
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Application #:
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11738817
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Filing Dt:
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04/23/2007
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Publication #:
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Pub Dt:
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10/23/2008
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Inventor:
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John Trezza
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Title:
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ULTRA-THIN CHIP PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| THREE WORLD FINANCIAL CENTER |
| NEW YORK, NEW YORK 10281-2101 |
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| MORGAN & FINNEGAN LLP |
| THREE WORLD FINANCIAL CENTER |
| NEW YORK, NY 10281-2101 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1209 ORANGE STREET |
| WILMINGTON, DELAWARE 19801 |
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| PAUL S HUNTER, FOLEY & LARDNER LLP |
| VEREX PLAZA |
| 150 EAST GILMAN STREET |
| MADISON, WI 53703-1481 |
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