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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/07/2010
Application #:
11772497
Filing Dt:
07/02/2007
Publication #:
Pub Dt:
01/08/2009
Inventor:
CHUNG-JUN CHU
Title:
HEAT-DISSIPATING CASING STRUCTURE
Assignment: 1
Reel/Frame:
019546/0392Recorded: 07/11/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/02/2007
Assignee:
9F., NO. 786, CHUNG-CHENG RD., CHUNG-HO CITY
TAIPEI HSIEN 235, TAIWAN R.O.C.
Correspondent:
MORTON J. ROSENBERG, ESQ.
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE, SUITE 1010
ELLICOTT CITY, MD 21043
Assignment: 2
Reel/Frame:
027567/0332Recorded: 01/20/2012Pages: 37
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/16/2011
Assignee:
160 GREENTREE DRIVE, SUITE 101
DOVER, DELAWARE 19904
Correspondent:
TUROCY & WATSON, LLP
127 PUBLIC SQUARE
57TH FLOOR, KEY TOWER
CLEVELAND, OH 44114

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