Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/05/2011
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Application #:
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11984339
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Filing Dt:
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11/16/2007
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Publication #:
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Pub Dt:
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03/26/2009
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Inventors:
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Chia-Hao Wu, Chen-Hsiu Lin
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Title:
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ASSEMBLY OF A HEAT DISSIPATING BASE AND A LEAD FRAME FOR A LIGHT EMITTING DIODE PACKAGING DEVICE AND METHOD FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22F, 392, RUEY KUANG RD. |
| NEIHU, TAIPEI, TAIWAN |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE-SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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