Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11864899
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Filing Dt:
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09/28/2007
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Publication #:
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Pub Dt:
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04/02/2009
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Inventors:
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Willy Rachmady, Brian S. Doyle, Jack Kavalieros, Rajwinder Singh
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Title:
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METHOD OF ACHIEVING ATOMICALLY SMOOTH SIDEWALLS IN DEEP TRENCHES, AND HIGH ASPECT RATIO SILICON STRUCTURE CONTAINING ATOMICALLY SMOOTH SIDEWALLS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| INTEL CORPORATION, C/O INTELLEVATE, LLC |
| PO BOX 52050 |
| MINNEAPOLIS, MN 55402 |
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