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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11930449
Filing Dt:
10/31/2007
Publication #:
Pub Dt:
04/30/2009
Inventors:
Hong Deng, Yoshihiro Ikeda
Title:
SYSTEM, METHOD AND APPARATUS FOR ELIMINATING ADHESION LAYERS BETWEEN SUBSTRATES AND SOFT UNDERLAYERS IN PERPENDICULAR MEDIA
Assignment: 1
Reel/Frame:
020053/0688Recorded: 11/01/2007Pages: 7
Conveyance:
SECURITY AGREEMENT (PATENTS)
Assignor:
Exec Dt:
10/24/2007
Assignee:
600 DE LA GAUCHETIERE STREET WEST
GROUND FLOOR
MONTREAL, CANADA H3B 4L2
Correspondent:
JESSICA DAVIS
111 HUNTINGTON AVENUE
BOSTON, MA 02199
Assignment: 2
Reel/Frame:
020042/0068Recorded: 10/31/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/25/2007
Exec Dt:
10/30/2007
Assignee:
LOCATELLIKADE 1
PARNASSUSTOREN
1076 AZ AMSTERDAM, NETHERLANDS
Correspondent:
MICHAEL E. NOE, JR.
PO BOX 61389
BRACEWELL & GIULIANI LLP
HOUSTON, TX 77208-1389

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