Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12291069
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Filing Dt:
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11/05/2008
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Publication #:
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Pub Dt:
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07/09/2009
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Inventors:
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Jong-Won Hong, Min-Keun Kwak, Geum-Jung Seong, Jong-Myeong Lee, Gil-Heyun Choi et al
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Title:
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Bonding pad structure and semiconductor device including the bonding pad structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416, MAETAN-DONG |
| YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| STEVEN M. MILLS |
| MILLS & ONELLO LLP |
| ELEVEN BEACON STREET, SUITE 605 |
| BOSTON, MASSACHUSETTS 02108 |
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