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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12305799
Filing Dt:
03/12/2009
Publication #:
Pub Dt:
09/10/2009
Inventors:
Harold Samuel Gamble, Brian Mervyn Armstrong, David William McNeil et al
Title:
IC Substrate and Method of Manufacture of IC Substrate
Assignment: 1
Reel/Frame:
022474/0808Recorded: 03/31/2009Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/10/2009
Exec Dt:
02/10/2009
Exec Dt:
02/10/2009
Exec Dt:
02/10/2009
Assignee:
UNIVERSITY ROAD
BELFAST, UNITED KINGDOM BT7 1NN
Correspondent:
CHOATE HALL & STEWART
TWO INTERNATIONAL PLACE
BOSTON, MA 02110

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