Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/2011
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Application #:
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12474107
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Filing Dt:
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05/28/2009
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Publication #:
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Pub Dt:
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09/24/2009
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Inventors:
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Lei Shi, Ming Sun, Kai Liu
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Title:
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SEMICONDUCTOR PACKAGE HAVING A BRIDGED PLATE INTERCONNECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 475 OAKMEAD PKWY |
| SUNNYVALE, CALIFORNIA 94085 |
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| JANE ZHANG |
| 111 W. ST. JOHN STREET, SUITE 1250 |
| SAN JOSE, CA 95113 |
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