Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12347800
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Filing Dt:
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12/31/2008
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Publication #:
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Pub Dt:
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07/01/2010
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Inventors:
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Ravikumar Adimula, Myung Jin Yim
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Title:
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SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| INTEL/BSTZ BLAKELY SOKOLOFF TAYLOR & ZAF |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085-4040 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT NAME OF ASSIGNEE PREVIOUSLY RECORDED AT REEL/FRAME 024573/0901. (ATTACHED)
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| ZONE D'ACTIVITES, LA PIECE 2, A-ONE |
| BUSINESS CENTER, ROUTE DE L'ETAZ |
| 1180 ROLLE, SWITZERLAND |
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| BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CALIFORNIA 94085-4040 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707 |
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| BERKELEY LAW & TECHNOLOGY GROUP LLP |
| 17933 NW EVERGREEN PARKWAY |
| SUITE 250 |
| BEAVERTON, OR 97006 |
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