Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12796520
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Filing Dt:
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06/08/2010
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Publication #:
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Pub Dt:
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01/13/2011
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Inventors:
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William L. Brenneman, Szuchain F. Chen
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Title:
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Support Layer for Thin Copper Foil
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Assignment:
1
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| 30 HUDSON STREET |
| 36TH FLOOR |
| JERSEY CITY, NEW JERSEY 07302 |
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| ANGELA M. AMARU C/O LATHAM & WATKINS |
| 885 THIRD AVENUE |
| SUITE 1000 |
| NEW YORK, NY 10022 |
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Assignment:
2
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AMENDMENT NO. 1 PATENT AGREEMENT, TO PATENT AGREEMENT RECORDED ON 11/27/01, REEL 20156, FRAME 0265.
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| 12 EAST 49TH STREET |
| NEW YORK, NEW YORK 10017 |
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| SUSAN O'BRIEN |
| CT LIEN SOLUTIONS |
| 187 WOLF ROAD, SUITE 101 |
| ALBANY, NEW YORK 12205 |
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Assignment:
3
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RELEASE OF SECURITY INTEREST IN PATENTS
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| 4801 OLYMPIA PARK PLAZA, SUITE 3500 |
| LOUISVILLE, KENTUCKY 40241 |
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| 475 N. MARTINGALE ROAD, SUITE 1050 |
| SCHAUMBURG, ILLINOIS 60173 |
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| LINDSAY N. SILBER |
| 1285 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10019-6064 |
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