Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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07/28/2015
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Application #:
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12561897
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Filing Dt:
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09/17/2009
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Publication #:
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Pub Dt:
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03/17/2011
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Inventors:
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SeungYun Ahn, JoHyun Bae, SangJin Lee
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| LAW OFFICES OF MIKIO ISHIMARU |
| 333 W. EL CAMINO REAL |
| SUITE 330 |
| SUNNYVALE, CA 94087 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 39TH FLOOR, CITIBANK TOWER, CITIBANK PLAZA, 3 GARDEN ROAD |
| CENTRAL, HONG KONG |
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| MILBANK, TWEED, HADLEY & MCCLOY, LLP |
| 28 LIBERTY STREET |
| C/O LAWRENCE KASS |
| NEW YORK, NY 10005 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #04-08/09 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| WONG & REES LLP |
| 4677 OLD IRONSIDES DRIVE |
| SUITE 370 |
| SANTA CLARA, CA 95054 |
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Assignment:
4
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 46429 LANDING PARKWAY |
| FREMONT, CALIFORNIA 94538 |
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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