Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/21/2012
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Application #:
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12648954
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Filing Dt:
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12/29/2009
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Publication #:
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Pub Dt:
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06/30/2011
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Inventor:
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Tsorng-Dih YUAN
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Title:
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FLIP CHIP PACKAGE HAVING ENHANCED THERMAL AND MECHANICAL PERFORMANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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| LOWE HAUPTMAN HAM & BERNER, LLP |
| 1700 DIAGONAL ROAD |
| SUITE 300 |
| ALEXANDRIA, VA 22314 |
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