Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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13084706
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Filing Dt:
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04/12/2011
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Publication #:
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Pub Dt:
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08/04/2011
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Inventors:
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Radesh Jewram, William E. McIntosh, Jeremy J. Schmitz
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Title:
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Method for Packaging Thermal Interface Materials
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18930 WEST 78TH STREET |
| CHANHASSEN, MINNESOTA 55317 |
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| MARK J. BURNS |
| 121 SOUTH EIGHTH STREET |
| 1130 TCF TOWER |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HENKELSTRASSE 67 |
| DUSSELDORF, GERMANY 40589 |
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| HAUGEN LAW FIRM PLLP |
| 121 SOUTH EIGHTH STREET |
| 1130 TCF TOWER |
| MINNEAPOLIS, MN 55402 |
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