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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/12/2016
Application #:
13455214
Filing Dt:
04/25/2012
Publication #:
Pub Dt:
11/01/2012
Inventors:
Cheng-Hsien Wu, Cheng-Hao Chiu, Chieh-Ju Wu, Kai-En Chang
Title:
Adjustment Mechanism of Mold System Having Electrically Adjusting and Positioning Functions
Assignment: 1
Reel/Frame:
028101/0787Recorded: 04/25/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/28/2012
Exec Dt:
03/28/2012
Exec Dt:
03/28/2012
Exec Dt:
03/28/2012
Assignee:
NO. 415, CHIEN-KUNG RD.
KAOHSIUNG, TAIWAN R.O.C.
Correspondent:
KAMRATH IP LAWFIRM, P.A.
4825 OLSON MEMORIAL HIGHWAY
SUITE 245
GOLDEN VALLEY, MN 55422

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