Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/29/2014
|
Application #:
|
13361716
|
Filing Dt:
|
01/30/2012
|
|
Publication #:
|
|
Pub Dt:
|
01/31/2013
| | | | |
|
Inventors:
|
Efren M. Lacap, Subhash Rewachand Nariani, Charles Nickel
|
|
Title:
|
WAFER-LEVEL CHIP SCALE PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 47467 FREMONT BOULEVARD |
| FREMONT, CALIFORNIA 94538 |
|
|
|
|
| LATHROP & GAGE LLP |
| 4845 PEARL EAST CIRCLE |
| SUITE 201 |
| BOULDER, CO 80301 |
|
|
Search Results as of:
05/31/2024 11:11 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
