Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/26/2013
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Application #:
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13208349
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Filing Dt:
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08/12/2011
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Publication #:
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Pub Dt:
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02/14/2013
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Inventors:
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Yantao Ma, Aaron Willey
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE WITH COMMON GOLD PLATED METAL CONDUCTOR ON DIE AND SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HWA-YA TECHNOLOGY PARK 669, FUHSING 3 RD., KUEISHAN |
| TAO-YUAN HSIEN, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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