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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	8652939	Issue Dt:	02/18/2014	Application #:	13276184	Filing Dt:	10/18/2011
Publication #:	20130093094	Pub Dt:	04/18/2013
Inventors:	Ming-Chung Sung, Yu-Chih Liu, Wei-Ting Lin, Chien-Hsiun Lee
Title:	METHOD AND APPARATUS FOR DIE ASSEMBLY

Assignment: 1

Reel/Frame:

027179/0500

Recorded: 11/04/2011

Pages: 2

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

SUNG, MING-CHUNG

Exec Dt:

10/17/2011

LIU, YU-CHIH

Exec Dt:

10/17/2011

LIN, WEI-TING

Exec Dt:

10/17/2011

LEE, CHIEN-HSIUN

Exec Dt:

10/18/2011

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY

NO. 8, LI-HSIN RD. 6

SCIENCE-BASED INDUSTRIAL PARK

HSIN-CHU, TAIWAN 300-77

Correspondent:

SLATER & MATSIL, L.L.P.

17950 PRESTON ROAD

SUITE 1000

DALLAS, TX 75252

Assignment: 2

Reel/Frame:

027198/0772

Recorded: 11/09/2011

Pages: 4

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE SERIAL NUMBER BEING ASSIGNED PREVIOUSLY RECORDED ON REEL 027179 FRAME 0500. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS' INTEREST TO TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY.

Assignors:

SUNG, MING-CHUNG

Exec Dt:

10/17/2011