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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/25/2017
Application #:
13536827
Filing Dt:
06/28/2012
Publication #:
Pub Dt:
11/28/2013
Inventors:
Nikhil KELKAR, Nattorn PONGRATANANUKUL, Steven R. RIVET, Jian YIN et al
Title:
CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY (HDA) POWER MODULE, AND METHOD OF MAKING SAME
Assignment: 1
Reel/Frame:
029587/0415Recorded: 01/08/2013Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/27/2012
Exec Dt:
11/09/2012
Exec Dt:
07/02/2012
Exec Dt:
06/28/2012
Exec Dt:
07/02/2012
Exec Dt:
06/27/2012
Exec Dt:
07/05/2012
Assignee:
1001 MURPHY RANCH ROAD
MILPITAS, CALIFORNIA 95035
Correspondent:
GRAYBEAL JACKSON LLP
400 - 108TH AVENUE N.E., SUITE 700
BELLEVUE, WA 98004

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