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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13671194
Filing Dt:
11/07/2012
Publication #:
Pub Dt:
05/08/2014
Inventor:
Corey Reichman
Title:
Method And System For A Chaser Pellet In A Semiconductor Package Mold Process
Assignment: 1
Reel/Frame:
029258/0265Recorded: 11/07/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/07/2012
Assignee:
1900 SOUTH PRICE ROAD
CHANDLER, ARIZONA 85286-6604
Correspondent:
MCANDREWS, HELD & MALLOY
500 WEST MADISON
34TH FLOOR
CHICAGO, IL 60661
Assignment: 2
Reel/Frame:
035613/0592Recorded: 05/07/2015Pages: 24
Conveyance:
PATENT SECURITY AGREEMENT
Assignor:
Exec Dt:
04/09/2015
Assignee:
901 MAIN STREET, 11TH FLOOR
DALLAS, TEXAS 75202
Correspondent:
STEPHEN P. DEMM - HUNTON & WILLIAMS LLP
951 EAST BYRD STREET
RIVERFRONT PLAZA - EAST TOWER
RICHMOND, VA 23219-4074

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