Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/21/2017
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Application #:
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14173807
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Filing Dt:
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02/05/2014
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Publication #:
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Pub Dt:
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08/06/2015
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Inventors:
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He REN, Mehul B. NAIK, Yong CAO, Mei-Yee SHEK, Yana Cheng, Sree Rangasai V. Kesapragada
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Title:
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DIELECTRIC/METAL BARRIER INTEGRATION TO PREVENT COPPER DIFFUSION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| PATTERSON & SHERIDAN, LLP - - APPLIED MA |
| 3040 POST OAK BOULEVARD, SUITE 1500 |
| HOUSTON, TX 77056 |
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