Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14485346
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Filing Dt:
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09/12/2014
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Publication #:
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Pub Dt:
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03/17/2016
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Inventors:
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Chiu-pien KUO, Cary HUNG, Sumit AGARWAL, Shawn HSIEH
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Title:
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METHOD FOR ETCHING A HARDMASK LAYER FOR AN INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR APPLICATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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| PATTERSON & SHERIDAN, LLP |
| 24 GREENWAY PLAZA, SUITE 1600 |
| HOUSTON, TX 77046 |
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