Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/29/2017
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Application #:
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14943691
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Filing Dt:
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11/17/2015
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Publication #:
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Pub Dt:
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05/12/2016
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Inventors:
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Paul S. Andry, John U. Knickerbocker, Robert D. Allen, Jeffrey D. Gelorme, Li-wen Hung et al
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Title:
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LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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TUTUNJIAN & BITETTO, P.C. |
425 BROADHOLLOW ROAD, SUITE 302 |
MELVILLE, NY 11747 |
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