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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/06/2018
Application #:
14857379
Filing Dt:
09/17/2015
Publication #:
Pub Dt:
05/19/2016
Inventors:
Amjad Huda, Jie Zhou, Victor Joseph, Alnoor Shivji
Title:
Thermo-controllable high-density chips for multiplex analyses
Assignment: 1
Reel/Frame:
037128/0860Recorded: 11/24/2015Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/06/2005
Exec Dt:
07/06/2005
Exec Dt:
07/06/2005
Exec Dt:
07/06/2005
Assignee:
7400 PASEO PADRE PARKWAY
FREMONT, CALIFORNIA 94555
Correspondent:
JASON R. BOND
2275 DEMING WAY, STE 310
MIDDLETON, WI 53562
Assignment: 2
Reel/Frame:
043631/0517Recorded: 09/19/2017Pages: 7
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/31/2017
Assignee:
1290 TERRA BELLA AVENUE
MOUNTAIN VIEW, CALIFORNIA 94043
Correspondent:
BOZICEVIC, FIELD & FRANCIS LLP
201 REDWOOD SHORES PARKWAY
SUITE 200
REDWOOD CITY, CA 94065

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