Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
03/21/2017
|
Application #:
|
15077113
|
Filing Dt:
|
03/22/2016
|
Publication #:
|
|
Pub Dt:
|
07/14/2016
| | | | |
Inventors:
|
Robert D. Allen, Jeffrey D. Gelorme, John U. Knickerbocker, Paul S. Andry, Li-wen Hung et al
|
Title:
|
LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
|
|
|
TUTUNJIAN & BITETTO, P.C. |
425 BROADHOLLOW ROAD, SUITE 302 |
MELVILLE, NY 11747 |
|
|
Search Results as of:
05/24/2024 05:38 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|