Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/02/2021
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Application #:
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14991800
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Filing Dt:
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01/08/2016
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Publication #:
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Pub Dt:
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07/14/2016
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Inventors:
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O-hyun BEAK, Keon KUK, Yong-chul KO, Woon-bae KIM
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO |
| YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| MCANDREWS HELD & MALLOY, LTD |
| 500 WEST MADISON STREET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
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