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Patent Assignment Abstract of Title
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Total Assignments: 4
Patent #:
NONE
Issue Dt:
Application #:
15009012
Filing Dt:
01/28/2016
Publication #:
20160221820
Pub Dt:
08/04/2016
Inventors:
YungWoo Lee, ByungJun Kim, DongHyun Bang, EunNaRa Cho, Adrian Arcedera, JaeUng Lee
Title:
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
Assignment: 1
Reel/Frame:
037839/0966Recorded: 02/26/2016Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEE, YUNG WOO
Exec Dt:
02/01/2016
KIM, BYUNG JUN
Exec Dt:
02/04/2016
BANG, DONG HYUN
Exec Dt:
02/02/2016
CHO, EUNNARA
Exec Dt:
02/01/2016
LEE, JAE UNG
Exec Dt:
02/01/2016
Assignee:
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
MCANDREWS HELD & MALLOY
500 W MADISON STREET
FLOOR 34
CHICAGO, IL 60661
Assignment: 2
Reel/Frame:
038445/0660Recorded: 04/15/2016Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEE, YUNG WOO
Exec Dt:
02/01/2016
KIM, BYUNG JUN
Exec Dt:
02/04/2016
BANG, DONG HYUN
Exec Dt:
02/02/2016
CHO, EUNNARA
Exec Dt:
02/01/2016
LEE, JAE UNG
Exec Dt:
02/01/2016
Assignee:
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
MCANDREWS HELD & MALLOY
500 W MADISON ST
FLOOR 34
CHICAGO, IL 60661
Assignment: 3
Reel/Frame:
048105/0422Recorded: 01/22/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
ARCEDERA, ADRIAN
Exec Dt:
02/01/2016
Assignee:
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
MCANDREWS, HELD & MALLOY, LTD.
500 WEST MADISON STREET
34TH FLOOR
CHICAGO, IL 60661
Assignment: 4
Reel/Frame:
046683/0139Recorded: 08/01/2018Pages: 67
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
AMKOR TECHNOLOGY, INC.
Exec Dt:
07/13/2018
Assignee:
BANK OF AMERICA, N.A., AS AGENT
333 SOUTH HOPE STREET
19TH FLOOR
LOS ANGELES, CALIFORNIA 90071
Correspondent:
MCGUIREWOODS LLP
1750 TYSONS BOULEVARD
SUITE 1800
TYSONS, VA 22102

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