Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/24/2019
|
Application #:
|
15274590
|
Filing Dt:
|
09/23/2016
|
|
Publication #:
|
|
Pub Dt:
|
01/12/2017
| | | | |
|
Inventors:
|
Heinz-Peter Wirtz, Yaojian Lin, Seung Wook Yoon, Pandi C. Marimuthu
|
|
Title:
|
Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
|
|
|
|
| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
|
|
Search Results as of:
05/23/2024 07:05 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
