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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/10/2017
Application #:
14825393
Filing Dt:
08/13/2015
Publication #:
Pub Dt:
02/16/2017
Inventors:
Russell A. Budd, Mounir Meghelli, Jason Scott Orcutt, Jean-Olivier Plouchart
Title:
PACKAGING OPTOELECTRONIC COMPONENTS AND CMOS CIRCUITRY USING SILICON-ON-INSULATOR SUBSTRATES FOR PHOTONICS APPLICATIONS
Assignment: 1
Reel/Frame:
036320/0468Recorded: 08/13/2015Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/13/2015
Exec Dt:
08/12/2015
Exec Dt:
08/12/2015
Exec Dt:
08/13/2015
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
FRANK V. DEROSA
48 SOUTH SERVICE ROAD, SUITE 100
RYAN, MASON & LEWIS, LLP
MELVILLE, NY 11747
Assignment: 2
Reel/Frame:
036867/0226Recorded: 10/14/2015Pages: 14
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 4TH INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 036320 FRAME: 0468. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
08/13/2015
Exec Dt:
08/12/2015
Exec Dt:
08/12/2015
Exec Dt:
10/14/2015
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
FRANK V. DEROSA
48 SOUTH SERVICE ROAD, SUITE 100
RYAN, MASON & LEWIS, LLP
MELVILLE, NY 11747

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