Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/12/2019
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Application #:
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15423788
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Filing Dt:
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02/03/2017
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Publication #:
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Pub Dt:
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05/25/2017
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Inventors:
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Yeh-Chi HSU, Chen-Yueh KUNG
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Title:
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CIRCUIT SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 301, NO.2537, JINKE ROAD, ZHANGJIANG HI-TECH PARK |
| SHANGHAI, CHINA 201203 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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