Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/31/2020
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Application #:
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15266786
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Filing Dt:
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09/15/2016
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Publication #:
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Pub Dt:
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03/15/2018
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Inventors:
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Timothy Joseph Chainer, Michael Anthony Gaynes, Gerard McVicker et al
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Title:
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CHIP PACKAGE FOR TWO-PHASE COOLING AND ASSEMBLY PROCESS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| AMIN, TUROCY & WATSON, LLP |
| 127 PUBLIC SQUARE, 57TH FL. |
| CLEVELAND, OH 44114 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| AMIN, TUROCY & WATSON, LLP - IBM |
| 127 PUBLIC SQUARE, 57TH FLOOR |
| KEY TOWER |
| CLEVELAND, OH 44114 |
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