Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/08/2019
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Application #:
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15647871
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Filing Dt:
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07/12/2017
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Publication #:
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Pub Dt:
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04/05/2018
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Inventors:
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JaeHong Park, Hanhong LEE, Sungwoo JOO, Woon-young BAEK
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Title:
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SEMICONDUCTOR PACKAGES THAT INCLUDE A HEAT PIPE FOR EXHAUSTING HEAT FROM ONE OR MORE ENDS OF THE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF 16677 |
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| MYERS BIGEL, P.A. |
| PO BOX 37428 |
| RALEIGH, NC 27627 |
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