Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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02/02/2021
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Application #:
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15888003
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Filing Dt:
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02/03/2018
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Publication #:
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Pub Dt:
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06/07/2018
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Inventors:
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Won Bae BANG, Byong Jin KIM, Gi Jeong KIM, Ji Young CHUNG
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Title:
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METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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| LAW OFFICE OF KEVIN JACKSON |
| 6315 E. CACTUS WREN RD |
| PARADISE VALLEY, AZ 85253 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 333 SOUTH HOPE STREET |
| 19TH FLOOR |
| LOS ANGELES, CALIFORNIA 90071 |
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| MCGUIREWOODS LLP |
| 1750 TYSONS BOULEVARD |
| SUITE 1800 |
| TYSONS, VA 22102 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491B RIVER VALLEY ROAD |
| VALLEY POINT #12-03, SINGAPORE 248373 |
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| LAW OFFICE OF KEVIN B JACKSON |
| 6315 E CACTUS WREN RD |
| PARADISE VALLEY, AZ 85253-8006 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 491 B RIVER VALLEY ROAD |
| #15-02/04 |
| VALLEY POINT, SINGAPORE 248373 |
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| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STREET |
| 34TH FLOOR |
| CHICAGO, IL 60661 |
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