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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/04/2021
Application #:
15900178
Filing Dt:
02/20/2018
Publication #:
Pub Dt:
06/21/2018
Inventors:
Jeffrey D. Gelorme, Bing Dang, John U. Knickerbocker
Title:
THERMOPLASTIC TEMPORARY ADHESIVE FOR SILICON HANDLER WITH INFRA-RED LASER WAFER DE-BONDING
Assignment: 1
Reel/Frame:
044979/0155Recorded: 02/20/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/23/2015
Exec Dt:
04/29/2015
Exec Dt:
04/30/2015
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
TUTUNJIAN & BITETTO, P.C.
401 BROADHOLLOW ROAD, SUITE 402
MELVILLE, NY 11747

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