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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/05/2019
Application #:
15482277
Filing Dt:
04/07/2017
Publication #:
Pub Dt:
10/11/2018
Inventors:
Richard B. Brown, Ondrej Novak
Title:
MICROFLUIDICS CHIP WITH SENSOR DIE CLAMPING STRUCTURES
Assignment: 1
Reel/Frame:
041933/0081Recorded: 04/07/2017Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/29/2017
Exec Dt:
03/29/2017
Assignee:
630 KOMAS DRIVE, SUITE 235
SALT LAKE CITY, UTAH 84108
Correspondent:
DELLA L. GONZALES
2816 LAGO VISTA LANE
PATENT CAPITAL GROUP
ROCKWALL, TX 75032
Assignment: 2
Reel/Frame:
049530/0567Recorded: 06/19/2019Pages: 5
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE FIRST ASSIGNOR'S FULL NAME PREVIOUSLY RECORDED ON REEL 041933 FRAME 0081. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
03/29/2017
Exec Dt:
03/29/2017
Assignee:
630 KOMAS DRIVE, SUITE 235
SALT LAKE CITY, UTAH 84108
Correspondent:
DELLA GONZALES
20 E. THOMAS RD., SUITE 2200, PMB 96
ALLIANCE IP, LLC
PHOENIX, AZ 85012

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