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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
10/19/2021
Application #:
16042798
Filing Dt:
07/23/2018
Publication #:
Pub Dt:
12/06/2018
Inventors:
Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong et al
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
054082/0599Recorded: 10/16/2020Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/09/2018
Exec Dt:
04/03/2018
Exec Dt:
06/05/2018
Exec Dt:
06/05/2018
Exec Dt:
04/18/2018
Exec Dt:
04/03/2018
Exec Dt:
05/28/2018
Exec Dt:
06/05/2018
Exec Dt:
04/18/2018
Exec Dt:
04/20/2018
Assignee:
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
MCANDREWS HELD & MALLOY, LTD
500 WEST MADISON STREET
SUITE 3400
CHICAGO, IL 60661
Assignment: 2
Reel/Frame:
054046/0673Recorded: 10/12/2020Pages: 54
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/19/2019
Assignee:
491 B RIVER VALLEY ROAD
#15-02/04
VALLEY POINT, SINGAPORE 248373
Correspondent:
MCANDREWS, HELD & MALLOY, LTD.
500 WEST MADISON STREET
34TH FLOOR
CHICAGO, IL 60661
Assignment: 3
Reel/Frame:
066673/0517Recorded: 03/06/2024Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/28/2024
Assignee:
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
PHILIP HENRY SHERIDAN
500 W. MADISON STREET
SUITE 3400
CHICAGO, IL 60661

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