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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/30/2022
Application #:
16148178
Filing Dt:
10/01/2018
Publication #:
Pub Dt:
02/07/2019
Inventors:
Jae Yun Kim, Woon Kab Jung, Gi Tae Lim, Ju Hoon Yoon, Byong Woo Cho, Ji Young Chung et al
Title:
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN EXTENDED SUBSTRATE AND A BOTTOM SUBSTRATE
Assignment: 1
Reel/Frame:
061354/0774Recorded: 08/29/2022Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/09/2014
Exec Dt:
10/09/2014
Exec Dt:
11/04/2014
Exec Dt:
11/04/2014
Exec Dt:
10/09/2014
Exec Dt:
10/20/2014
Exec Dt:
10/13/2014
Exec Dt:
10/22/2014
Exec Dt:
10/13/2014
Exec Dt:
11/04/2014
Assignee:
2045 E. INNOVATION CIRCLE
TEMPE, ARIZONA 85284
Correspondent:
MCANDREWS, HELD & MALLOY, LTD.
500 W. MADISON STREET
3400
CHICAGO, IL 60661
Assignment: 2
Reel/Frame:
054046/0673Recorded: 10/12/2020Pages: 54
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/19/2019
Assignee:
491 B RIVER VALLEY ROAD
#15-02/04
VALLEY POINT, SINGAPORE 248373
Correspondent:
MCANDREWS, HELD & MALLOY, LTD.
500 WEST MADISON STREET
34TH FLOOR
CHICAGO, IL 60661

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