Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/02/2022
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Application #:
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16101869
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Filing Dt:
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08/13/2018
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Publication #:
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Pub Dt:
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02/21/2019
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Inventors:
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Xiaobo Shi, Laura M. Matz, Chris Keh-Yeuan Li, Ming-Shih Tsai, Pao-Chia Pan et al
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Title:
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CHEMICAL MECHANICAL PLANARIZATION (CMP) COMPOSITION AND METHODS THEREFORE FOR COPPER AND THROUGH SILICA VIA (TSV) APPLICATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8555 SOUTH RIVER PARKWAY |
| PATENT DEPT. |
| TEMPE, ARIZONA 85284 |
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| LISA HOFFMANN |
| 7350 TILGHMAN STREET, SUITE 104 |
| PATENT DEPT. |
| ALLENTOWN, PA 18106-9000 |
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