Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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02/04/2020
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Application #:
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16433539
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Filing Dt:
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06/06/2019
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Publication #:
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Pub Dt:
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09/19/2019
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Inventor:
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J. Robert Reid
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Title:
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INTEGRATED CHIP SCALE PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9333 BALBOA AVENUE |
| SAN DIEGO, CALIFORNIA 92123 |
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| NIELS HAUN |
| DANN, DORFMAN, HERRELL AND SKILLMAN, P.C. |
| 1601 MARKET ST, SUITE 2400 |
| PHILADELPHIA, PA 19103 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9333 BALBOA AVENUE |
| SAN DIEGO, CALIFORNIA 92123 |
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| NIELS HAUN |
| DANN, DORFMAN, HERRELL AND SKILLMAN, P.C. |
| 1601 MARKET ST, SUITE 2400 |
| PHILADELPHIA, PA 19103 |
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Assignment:
3
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FIRST LIEN SECURITY AGREEMENT
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| 745 SEVENTH AVENUE |
| NEW YORK, NEW YORK 10019 |
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| CT CORPORATION |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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Assignment:
4
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SECOND LIEN SECURITY AGREEMENT
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| 225 WEST WASHINGTON STREET, 9TH FLOOR |
| CHICAGO, ILLINOIS 60606 |
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| CT CORPORATION |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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