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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/15/2022
Application #:
16296646
Filing Dt:
03/08/2019
Publication #:
Pub Dt:
11/14/2019
Inventors:
SU BIN BAE, YU-GWANG JEONG, SHIN IL CHOI, SANG GAB KIM, JOON GEOL LEE
Title:
CONNECTING STRUCTURE OF A CONDUCTIVE LAYER
Assignment: 1
Reel/Frame:
048544/0383Recorded: 03/08/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/23/2018
Exec Dt:
10/23/2018
Exec Dt:
10/23/2018
Exec Dt:
10/23/2018
Exec Dt:
10/23/2018
Assignee:
1, SAMSUNG-RO, GIHEUNG-GU,
YONGIN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 17113
Correspondent:
F. CHAU & ASSOCIATES, LLC
130 WOODBURY ROAD
WOODBURY, NY 11797

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