Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16732666
|
Filing Dt:
|
01/02/2020
|
|
Publication #:
|
|
Pub Dt:
|
04/30/2020
| | | | |
|
Inventors:
|
Kamal K. Sikka, Shidong Li
|
|
Title:
|
Integrated Circuit Chip Carrier with In-Plane Thermal Conductance Layer
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
|
|
|
|
| ZIP GROUP PLLC - IBM FIS |
| 610 KINGSVIEW LN N |
| MINNEAPOLIS, MN 55447 |
|
|
Search Results as of:
05/24/2024 09:42 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
