Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/15/2020
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Application #:
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16354159
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Filing Dt:
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03/14/2019
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Publication #:
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Pub Dt:
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09/17/2020
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Inventors:
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Chia-Hao Hsu, Yung-Chi Lin, Wen-Chih Chiou, Chien-Ming Chiu, Tsang-Jiuh Wu
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Title:
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DIE STACK STRUCTURE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
HSINCHU, TAIWAN 300-78 |
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JCIPRNET |
P.O. BOX 600 TAIPEI GUTING |
TAIPEI CITY, 10099 TAIWAN |
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