Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/08/2022
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Application #:
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16518180
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Filing Dt:
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07/22/2019
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Publication #:
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Pub Dt:
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11/12/2020
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Inventors:
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Hongwen Zhang, Fen Chen, Francis Mutuku, Jie Geng, Ning-Cheng Lee
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Title:
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LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDER PASTE WITH MIXED SOLDER ALLOY POWDERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 111 BUSINESS PARK DRIVE |
| UTICA, NEW YORK 13502 |
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| SHEPPARD, MULLIN, RICHTER & HAMPTON LLP |
| 650 TOWN CENTER DRIVE, 4TH FLOOR |
| COSTA MESA, CA 92626 |
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