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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
16391250
Filing Dt:
04/22/2019
Publication #:
20200375069
Pub Dt:
11/26/2020
Inventors:
Yoatian Zhang, George R. Woody, Hung-Li Chang, Paul F. Carosa, Ramiro R. Montalvo
Title:
HIGH PRESSURE HEAT DISSIPATION APPARATUS FOR POWER SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
049263/0282Recorded: 05/23/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ZHANG, YOATIAN
Exec Dt:
05/10/2019
WOODY, GEORGE R.
Exec Dt:
05/10/2019
CHANG, HUNG-LI
Exec Dt:
05/10/2019
CAROSA, PAUL F
Exec Dt:
05/10/2019
MONTALVO, RAMIRO R
Exec Dt:
05/10/2019
Assignee:
RIMHURST, INC.
11F NO. 143 SHISHUNG RD.
SHILIN DISTRICT, TAIBEI, TAIWAN 11168
Correspondent:
THE LAW OFFICE OF KEVIN M. WELCH
P.O. BOX 494
HERMSOA BEACH, CA 90254
Assignment: 2
Reel/Frame:
051942/0378Recorded: 02/26/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
RIMHURST, INC.
Exec Dt:
02/04/2020
Assignee:
BEIJING E.MOTOR ADVANCE CO. LTD.
NO. 12 XINGHAI 1ST STREET
YIZHUANG ECONOMIC TECHNIQUE DEVELOPMENT ZONE
DAXING DISTRICT, BEIJING, CHINA 100176
Correspondent:
KEVIN M WELCH
P.O. BOX 494
HERMOSA BEACH, CA 90254

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