Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17028329
|
Filing Dt:
|
09/22/2020
|
|
Publication #:
|
|
Pub Dt:
|
01/21/2021
| | | | |
|
Inventors:
|
Yeong Beom Ko, Dong Jin Kim, Se Woong Cha
|
|
Title:
|
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
|
|
|
|
| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STRET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 491 B RIVER VALLEY ROAD |
| VALLEY POINT #12/03 |
| SINGAPORE, SINGAPORE 248373 |
|
|
|
|
| MCANDREWS, HELD & MALLOY, LTD. |
| 500 WEST MADISON STRET |
| SUITE 3400 |
| CHICAGO, IL 60661 |
|
|
Search Results as of:
05/23/2024 12:08 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
