Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/07/2022
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Application #:
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17068482
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Filing Dt:
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10/12/2020
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Publication #:
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Pub Dt:
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01/28/2021
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Inventors:
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Dong Won Son, Byeonghoon Kim, Sung Ho Choi, Sung Jae Lim, Jong Ho Shin, SungWon Cho et al
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Title:
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EMI Shielding for Flip Chip Package with Exposed Die Backside
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE 1ST INVENTOR'S EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 054030 FRAME: 0432. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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| PATENT LAW GROUP: ATKINS AND ASSOCIATES, P.C. |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
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