Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/15/2022
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Application #:
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16594288
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Filing Dt:
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10/07/2019
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Publication #:
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Pub Dt:
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04/08/2021
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Inventors:
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Venkateshwar R. Aitharaju, William R. Rodgers, Selina X. Zhao
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Title:
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REINFORCED PREFORM AND METHOD FOR MOLDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 300 |
| MAIL CODE 482-C23-B21 |
| DETROIT, MICHIGAN 48265-3000 |
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| QUINN IP LAW |
| 21500 HAGGERTY ROAD, STE 300 |
| NORTHVILLE, MI 48167 |
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Assignment:
2
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CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
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| 1000 INDEPENDENCE AVE. S.W. |
| WASHINGTON, DISTRICT OF COLUMBIA 20585 |
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| TIMOTHY L HARNEY |
| 9800 S. CASS AVE |
| IPLD |
| LEMONT, IL 60439 |
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