Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/28/2023
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Application #:
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16662158
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Filing Dt:
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10/24/2019
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Publication #:
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Pub Dt:
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04/29/2021
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Inventors:
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Hongqing Zhang, David J. Lewison, Yu Luo, Jay A. Bunt, Joyce Molinelli Acocella
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Title:
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NON-DESTRUCTIVE BOND LINE THICKNESS MEASUREMENT OF THERMAL INTERFACE MATERIAL ON SILICON PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| CANTOR COLBURN LLP POUGHKEEPSIE |
| 20 CHURCH STREET |
| 22ND FLOOR |
| HARTFORD, CT 06103 |
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