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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/28/2021
Application #:
16687778
Filing Dt:
11/19/2019
Publication #:
Pub Dt:
05/20/2021
Inventors:
Srikanth KULKARNI, Rajneesh KUMAR, Sayok CHATTOPADHYAY
Title:
STRUCTURE FOR ARRAYED PARTIAL MOLDING OF PACKAGES
Assignment: 1
Reel/Frame:
051602/0443Recorded: 01/23/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/21/2020
Exec Dt:
01/21/2020
Exec Dt:
01/21/2020
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121-1714
Correspondent:
PATTERSON + SHERIDAN, L.L.P. QUALCOMM
24 GREENWAY PLAZA, SUITE 1600
HOUSTON, TX 77046
Assignment: 2
Reel/Frame:
059218/0033Recorded: 03/10/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/18/2021
Assignee:
ROUTE DE LAUSANNE 319
BELLEVUE, SWITZERLAND 1293
Correspondent:
MARK M. FRIEDMAN
7 JABOTINSKY STREET
MOSHE AVIV TOWER, 54TH FLOOR
RAMAT GAN, 5252007 ISRAEL

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