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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17249338
Filing Dt:
02/26/2021
Publication #:
Pub Dt:
06/17/2021
Inventors:
Hailong Luo, Fei Qi
Title:
PACKAGING MODULE AND PACKAGING METHOD OF BAW RESONATOR
Assignment: 1
Reel/Frame:
059962/0871Recorded: 05/19/2022Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/22/2020
Exec Dt:
12/22/2020
Assignee:
ROOM 309, AREA C, F3, BUILDING 1, NO.95, LANE 85, CAILUN ROAD, PILOT FREE TRADE ZONE
SHANGHAI, CHINA 201210
Correspondent:
ANOVA LAW GROUP, PLLC
21495 RIDGETOP CIRCLE, SUITE 300
STERLING, VA 20166

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