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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11728233
Issue Dt:
08/15/2023
Application #:
16941847
Filing Dt:
07/29/2020
Publication #:
20210217676
Pub Dt:
07/15/2021
Inventors:
Po-Yao LIN, Po-Chen LAI, Che-Chia YANG, Yi-Hang LIN, Shu-Shen YEH, Shin-Puu JENG et al
Title:
CHIP PACKAGE STRUCTURE WITH RING STRUCTURE AND METHOD FOR FORMING THE SAME
Assignment: 1
Reel/Frame:
053341/0210Recorded: 07/29/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YEH, SHU-SHEN
Exec Dt:
07/07/2020
LIN, PO-YAO
Exec Dt:
07/17/2020
JENG, SHIN-PUU
Exec Dt:
07/07/2020
LAI, PO-CHEN
Exec Dt:
07/07/2020
LEE, KUANG-CHUN
Exec Dt:
07/07/2020
YANG, CHE-CHIA
Exec Dt:
07/07/2020
WANG, CHIN-HUA
Exec Dt:
07/07/2020
LIN, YI-HANG
Exec Dt:
07/07/2020
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
280 INTERSTATE NORTH CIRCLE SE
SUITE 550
ATLANTA, GA 30339

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